The HW2511LD665SM is a high-quality stackable connector series designed for secure PCB connections with a 2.54 mm pitch. Constructed with natural and black LCP insulators and phosphor bronze terminals, it features gold or tin plating options for enhanced durability and corrosion resistance. The connector supports operating temperatures from -55°C to +105°C, complying with RoHS standards, and is lead-free solderable. It is ideal for applications requiring precise stacking, mechanical stability with board spacers, and reliable electrical contact in electronic assemblies.
Insulator Material: Top Natural LCP, Bottom Black LCP
Terminal Material: Phosphor Bronze
Plating: Au or Sn over 50 µ
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Operating Temp Range: -55°C to +105°C
RoHS Compliant: Yes
Lead-Free Solderable: Yes
SMT Lead Coplanarity: 0.15 mm (0.006 inches)
Connector Series: Custom stackable connector for PCB applications
Number of Pins per Row: 10
Contact Arrangement: Multiple options including double row configurations
Physical Dimensions: 2.54 mm pitch, details available upon request
Buy the Buy Samtec HW2511LD665SM Part Number HW2511LD665SM Online
Get your Samtec HW2511LD665SM stackable PCB connector now through our online store. Designed with high-quality materials, it offers reliable electrical contact, RoHS compliance, and lead-free solderability. Perfect for precise stacking in electronic assemblies, this connector ensures durable connections across various temperature ranges from -55°C to +105°C. Compatible with automated assembly and featuring optimized coplanarity, it’s ideal for engineers seeking dependable, high-performance interconnect solutions for complex electronic applications. Purchase today for fast delivery and outstanding performance.
Order your Samtec HW2511LD665SM stackable connector today and ensure reliable, high-quality PCB connections with secure mechanical stability.
Frequently Asked Questions
Where can I buy SAMTEC HW2511LD665SM?
You can click on the BUY or RFQ button to purchase HW2511LD665SM from an authorized SAMTEC distributor.
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