The MTLW-130-05-G-S-110 is a high-quality low-profile board mate designed for reliable electrical connections in electronic assemblies. Featuring black Liquid Crystal Polymer insulation and gold-plated contacts, it ensures durability and corrosion resistance. Suitable for low-profile socket mating, this connector accommodates IDC assemblies and other applications requiring a compact form factor. It supports RoHS compliance and operates effectively within temperatures ranging from -55°C to +125°C with gold plating. The MTLW series is non-standard and non-returnable, providing specific performance features for demanding electronic projects.
Temperature Range: -55°C to +105°C (RoHS compliant), -55°C to +125°C with gold
Current Rating: 2 pins powered, 0.00 A per pin
Number of Positions: 6
Physical Dimensions: No. of Pins: 6, Lead Pitch: 2.54 mm (0.100 inch)
Style Options: Standard short post height, modified to accommodate IDC assemblies
RoHS Compliance: Yes, Lead-Free, Solderable
Insulator: Liquid Crystal Polymer, Black, custom lengths and styles available
Board Mates: Compatible with low-profile sockets, available in various options
Operating Temperature: -55°C to +125°C with gold plating, up to +105°C without
Certifications: Recognized under RoHS, non-standard, non-returnable parts
Buy the Buy Samtec Low Profile Board Mate Part Number MTLW11006GD155 Online
Purchase the Samtec Low Profile Board Mate Part Number MTLW11006GD155 online today to ensure robust electrical connections for your electronic projects. Crafted with premium Liquid Crystal Polymer insulation and gold-plated contacts, this connector provides excellent durability and corrosion resistance. Its design supports IDC assemblies and low-profile applications, making it ideal for space-constrained environments. RoHS compliant and rated for temperatures from -55°C to +125°C, it guarantees high performance in demanding conditions. Secure your supply now for reliable, long-lasting electronic connections.
Buy Samtec MTLW11006GD155 now and experience unmatched reliability and performance in compact electronic connections.
Frequently Asked Questions
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