The MTMM connect series are modified through-hole headers designed for reliable board-to-board connections in electronic assemblies. Built with high-quality Poses terminals and phosphor bronze contacts, these headers come with Sn or Au over Ni plating to ensure durability and corrosion resistance. They feature insulator materials like Liquid Crystal Polymer TCSD, operating over a temperature range of -55°C to +125°C, and are RoHS compliant. Suitable for high-density applications, they are available in various pin configurations, with precise dimensions and optional gold post finishes for enhanced connection performance.
Terminal Material: Phosphor Bronze, 0.13 mm (0.005') thickness
Plating: Sn or Au over 50 p" Ni
Operating Temperature Range: -55 °C to +105 °C with Tin; -55 °C to +125 °C with Gold
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch: 2.00 mm (0.0787 inches)
Number of positions: varies, with options for different pin counts
Physical dimensions: Length options from 6.48 mm (0.255 inches) to 21.08 mm (0.830 inches)
Height options: from 2.00 mm to 17.09 mm
Materials and finishes ensure durability; designs are customizable; subject to change without notice.
Compatible with various through-hole mounting techniques and high-density circuit designs.
Buy the Buy Samtec MTMM Series Headers Part Number MTMM10404GS165 Online
Enhance your electronic assemblies with high-quality modified through-hole headers designed by Samtec. Featuring phosphor bronze contacts, RoHS compliance, and options for gold or tin plating, these headers ensure reliable and durable connections. Available in various pin configurations and dimensions, they are ideal for high-density, through-hole mounting applications. Built with high-performance insulator materials like Liquid Crystal Polymer TCSD, they operate across a wide temperature range from -55°C to +125°C. Order today for dependable, precise circuit connections that withstand environmental stresses and ensure longevity.
Get Samtec MTMM series headers today—built for reliable, high-density electronic interconnections with corrosion-resistant gold or tin plating.
Frequently Asked Questions
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