The MTMM series is a modified through-hole header designed for reliable board-to-board connections in electronic assemblies. Made with black liquid crystal polymer insulators and phosphor bronze terminals, these headers feature tin or gold plating over nickel for corrosion resistance and optimal electrical conductivity. Operating temperature ranges from -55 °C to +105 °C with tin and up to +125 °C with gold plating. RoHS compliant and lead-free, they are suitable for various industrial, automation, and electronic manufacturing applications, offering robustness in high-vibration environments and compatibility with different mounting options.
Insulator Material: Liquid Crystal Polymer (LCP) in black
Terminal Material: Phosphor Bronze (0.13 mm) with Tin or Gold over 50 µ" Ni plating
Operating Temperature Range: -55 °C to +105 °C with Tin; -55 °C to +125 °C with Gold
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Module Pitch: 2.00 mm (0.0787 inches)
Number of Positions: Configurable, with available options up to 13 positions
Mounting Style: Through-hole
Design: Modified, non-standard, non-returnable
Buy the Samtec Series MTMM Through-Hole Header: MTMM10707LD250
Upgrade your electronic assemblies with the high-performance Samtec Series MTMM through-hole headers. These headers feature durable liquid crystal polymer insulators, phosphor bronze contacts, and offer options with tin or gold plating over nickel for superior conductivity and corrosion resistance. Designed for high-temperature applications, RoHS compliance, and lead-free solderability, they are suitable for industrial, automation, and manufacturing environments requiring secure and reliable connectivity. Order online now to ensure your projects meet the highest standards of quality and durability.
Order your Samtec Series MTMM through-hole header today and ensure reliable, high-performance electronic connections for your projects.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase MTMM10707LD250 from an authorized SAMTEC distributor.
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