SAMTEC MTSW10708GD215 High-Density Connector System
The MTSW series is a flexible, high-density connector system designed for PCB and cable interconnects, offering precise pitch options and customizable post heights. Constructed with a black glass-filled polyester insulator and phosphor bronze contacts, it features gold or tin plating for excellent solderability and corrosion resistance. Operating in temperatures from -55°C to +125°C, the series ensures reliable performance in demanding environments. Suitable for various applications, it provides stackability, polarization, and a range of post heights for tailored assembly solutions, compliant with RoHS standards.
SAMTEC MTSW10708GD215 High-Density Connector System Specifications:
Insulator Material: Black Glass Filled Polyester
Terminal Material: Phosphor Bronze
Plating: 50µin (1.27µm) Nickel on Gold; or Tin
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Height: Specify in inches, increments of 0.005" (0.13mm), up to 1.29" (32.77mm)
Pitch Options: 2.54mm (0.100") and 2.00mm (0.079")
No. of Positions: Varies from 4 to 30+
Design Features: Polarized, stackable, available in straight and right-angle options
Contact Material: Phosphor Bronze
Certifications: RoHS compliant, designed according to Samtec specifications
Buy the Samtec Series MTSW: PCB and Cable Connectors - MTSW10708GD215
Discover the versatility of the high-density connector system by Samtec. This PCB and cable connector offers customizable post heights, superb electrical performance, and excellent environmental resistance. Designed for demanding applications, it features high-quality phosphor bronze contacts with gold or tin plating, ensuring durability and reliable connections. Easy to assemble with polarized and stackable configurations, this connector supports a wide operating temperature range from -55°C to +125°C. Order online today to enhance your electronic assemblies with precision and flexibility.
Buy Samtec MTSW10708GD215 now and experience unmatched reliability and performance in high-density interconnect solutions.
Frequently Asked Questions
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