The MTSW10811TD435 is a high-density, low-profile stackable connector designed for flexible board-to-board connections. Constructed with black glass-filled polyester insulator and phosphor bronze contact material, it features gold and tin plating options for enhanced durability and conductivity. Suitable for operating temperatures from -55°C to +125°C with gold plating or -55°C to +105°C with tin. The connector supports various post heights in 0.005 inch increments, offering versatile configurations for demanding electronic applications. RoHS compliant, it is ideal for compact, reliable signal and power connections in modern electronics.
Plating: 50 microinches (1.27 micrometers) Nickel with Gold or Tin options
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Height: Specify in 0.005 inch increments, range up to 1.29 inches
Number of Positions: Configurable
Connector Style: Stackable, Board-to-Board
Physical Dimensions: Vary with configuration, detailed scope in technical datasheets
Construction: High-density, low-profile design for space-saving applications
Buy the Samtec Series HMTSW High-Density Connector: MTSW10811TD435
Order the Samtec HMTSW10811TD435 online today and experience reliable, space-saving board-to-board connections. Designed with durable materials and flexible configurations, this connector ensures optimal performance across a wide temperature range from -55°C to +125°C. Perfect for compact electronic assemblies, it supports various post heights and plating options—gold or tin—meeting RoHS standards. Quick and easy to install, buy online now for high-quality, dependable connections in your electronic projects and manufacturing processes.
Get Samtec HMTSW10811TD435 today—built for precision and long-lasting durability.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase MTSW10811TD435 from an authorized SAMTEC distributor.
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