High-density stacking connector designed for flexible board-to-board applications, featuring various post heights, gold or tin plating for reliable interconnections, and compliant with RoHS standards. Suitable for industrial and electronic equipment, it offers multiple configurations including straight and right-angle versions to meet diverse assembly needs, with operating temperatures ranging from -55°C to +125°C. Constructed with black glass-filled polyester insulators and phosphor bronze contacts, these connectors are engineered for durability, precision, and high-density interconnections in complex electronic systems.
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Heights: Specify in inches (.005" increments), e.g., 0.25mm (0.01")
Configuration: Straight and Right-Angle (RA) versions
Max Number of Positions: Varies with model, typically up to 28
Dimensions: Length varies with configuration, typical post height 0.25" (6.35 mm)
Compatibility: Suitable for high-density electronic assemblies, board-to-board connections
Design: Non-standard, non-returnable series
Compliance: RoHS, UL-listed, suitable for industrial electronics
Environmental: Operating temp range from -55°C to +125°C
Buy the Samtec MTSW11609GT007 – Reliable Board-to-Board Connector for Industrial Applications
Purchase the Samtec MTSW11609GT007 high-density stacking connector online today to ensure reliable, durable, and precise electronic connections. Designed with versatile configurations, including straight and right-angle options, and customizable post heights, this connector meets demanding industrial and electronic system requirements. Featuring gold or tin plating for excellent contact reliability and RoHS compliance for environmentally friendly applications, it is suitable for high-performance, high-density electronic assemblies. Ensure your project has the best connectivity components—buy online now for fast delivery and technical support.
Get Samtec MTSW11609GT007 today—built for precision and high-density electronic interconnections.
Frequently Asked Questions
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