The MTSW series offers high-flexibility board and cable mates with a variety of configurations suitable for customizable, high-density electronic connections. Made from black glass-filled polyester insulators with phosphor bronze contacts, these modules operate within -55°C to +125°C, depending on plating. They feature gold or tin plating, RoHS compliance, and optional right-angle or straight pin options. Designed for precise applications, they ensure reliable connection and easy customization, making them ideal for advanced electronic assemblies requiring modular stacking and flexible mounting options.
Plating: 50 microinches Nickel, Gold or Tin options
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Mounting Style: Straight or Right-Angle
Post Height: Specify in inches, increments of .005" (0.13 mm), typically 0.094" (2.39 mm)
Number of Positions: Varies (e.g., 9, 10, 13, 22, 23, 27, 28, etc.)
Pitch: 2.54 mm (0.100") or 0.025" (0.635 mm)
Compatibility: Modular stacking, Cable and Board Mates
Temperature Rating: up to +125°C depending on plating
Standards: RoHS compliant, engineered to Samtec specifications
Design Variations: With optional -RA (Right-Angle), varying post heights, and configurations for high-density interconnections
Please see www.samtec.com for complete specifications and options.
Buy the Buy Samtec High-Density Stacking Connectors Part Number MTSW20711TS704 Online
Enhance your electronic assembly with the high-density stacking connector available online. Designed for reliability, these connectors feature customizable configurations, a wide operating temperature range, and RoHS compliance. Made from durable insulator materials with gold or tin plating, they support both straight and right-angle options for versatile mounting. Perfect for demanding applications requiring flexible, high-performance interconnect solutions, order now to streamline your production process and ensure dependable connections in complex systems.
Buy Samtec MTSW20711TS704 now and experience unmatched reliability and performance in high-density electronic module stacking.
Frequently Asked Questions
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