TE CONNECTIVITY 14101893 Datasheet & Stock

The part is a 56-position, 7-row by 8-column right-angle board-to-board high-speed connector featuring gold-plated phosphor bronze contacts with a 0.76 µm gold finish and a black LCP housing. It belongs to the MULTIGIG RT product line, a versatile and customizable backplane interconnect family utilizing modular, printed circuit-based, pinless components that can be configured in various combinations. These connectors support high data throughput, signal integrity, and flexibility for modern applications. The system uses printed circuit wafers tailored for differential or signal-end performance, allowing adjustments to impedance, propagation delay, and crosstalk to meet specific customer needs. Key features include customizable impedance-matched wafers, stackability, inverse sex backplane system with “pinless” interface, superior crosstalk performance, optimized footprints for signal integrity, cost-effective 0.56mm via for backplane fabrication, three levels of signal contact sequencing, durability rated for 200 cycles, and compatibility with MP-based fiber optic array interconnects. Suitable for use in computers and peripherals, defense, military and aerospace, medical, industrial, and communications networking applications.

View 14101893Datasheet [pdf]