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TE CONNECTIVITY 223492012 zSFP+ Interconnect

The zSFP+ interconnect is a high-speed, pluggable I/O solution offering data rates up to 28 Gbps NRZ and 56 Gbps PAM-4, supporting Ethernet, Fibre Channel, and Telecom networks. Backward-compatible with SFP+ interfaces, it features surface-mount design, superior signal integrity, and options for EMI containment using elastomeric gaskets or spring fingers. The product supports various port configurations, including single and stacked assemblies with heat sinks, LEDs, and light pipes, ideal for data centers, telecommunications, and high-performance networking applications. It adheres to industry standards, ensuring reliable, long-term system flexibility and upgradeability.

Authorized Distributors
Source:Newark
Part No:2-2349201-2
Stock:9
Inv Date:06-09-2026
Price: Unit price: $270.82
Buy/RFQ:
Source:DigiKey
Part No:2-2349201-2
Stock:1
Inv Date:06-09-2026
Price: Unit price: $221.87
Buy/RFQ:
Source:DigiKey
Part No:2-2349201-2
Stock:8
Inv Date:06-09-2026
Price: Unit price: $192.52
Buy/RFQ:
Part No:2-2349201-2
Stock:9
Inv Date:06-10-2026
Price: Unit price: $228.39
Buy/RFQ:
Part No:2-2349201-2
Stock:0
Inv Date:06-09-2026
Price: Unit price: $366.73
Buy/RFQ:
Part No:2-2349201-2
Stock:8
Inv Date:06-09-2026
Price: Unit price: $271.68
Buy/RFQ:
Part No:2-2349201-2
Stock:8
Inv Date:06-09-2026
Price: Unit price: $271.68
Buy/RFQ:
Part No:2-2349201-2
Stock:5
Inv Date:06-09-2026
Price: Unit price: $196.2
Buy/RFQ:

TE CONNECTIVITY 223492012 zSFP+ Interconnect Specifications:

  • Data Rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10 Gbps Ethernet, 16 Gbps Fibre Channel
  • Connector Type: Surface-mount, high-temperature thermoplastic housing, nickel-silver cage, copper alloy contacts
  • Operating Temperature: -40 to +85°C
  • Voltage (max): 120V AC
  • Current (max): 0.5A
  • Dielectric Withstanding Voltage: 300V AC between contacts
  • Durability: Minimum 100 cycles
  • Physical Dimensions: Compatible with standard SFP+ cage dimensions, various port configurations available
  • Plating: Nickel underplating; Tin on solder tails; Gold or Palladium Nickel options
  • Mechanical: Mating force 25N, un-mating force 11.5N, cage press-fit force up to 54.3 N
  • EMI Containment: Elastomeric gasket or spring finger options
  • Included accessories: Light pipes, heat sinks, LEDs, and plating options

Buy the TE Connectivity Series zSFP+ Data Interconnect: 223492012

Experience unmatched data transfer speeds with TE Connectivity’s zSFP+ interconnect. Supporting data rates up to 28 Gbps and backward-compatible with SFP+ modules, it ensures reliable performance for data centers, telecom, and networking applications. The surface-mount design facilitates easy PCB integration, while options for EMI containment and various port configurations maximize system flexibility. Built with high-quality materials, including copper alloy contacts and thermoplastic housing, this pluggable I/O connector guarantees durability, ease of installation, and future upgradeability for demanding high-speed network environments.

Get TE Connectivity zSFP+ 223492012 today—built for precision, high speed, and long-lasting durability in high-performance networking systems.

Frequently Asked Questions

Where can I buy TE CONNECTIVITY 223492012?

You can click on the BUY or RFQ button to purchase 223492012 from an authorized TE CONNECTIVITY distributor.

How do I troubleshoot issues or seek technical support for part 223492012?

You can download the 223492012 datasheet or visit the TE CONNECTIVITY website for support.

Who is the manufacturer of 223492012?

TE CONNECTIVITY

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