WURTH ELEKTRONIK 40111020 Thermal Gap Filler Pad

The WE-TGF Thermal Gap Filler Pad is designed for high-performance thermal management in electronic devices. Made from silicone with ceramic particles and fiberglass mesh, it offers excellent thermal conductivity of 1 W/mK, dielectic strength up to 8 kV/mm, and Shore C hardness of 10. It operates safely between -50°C and +180°C, providing reliable heat dissipation and electrical insulation. Certification compliance includes RoHS, REACH, halogen-free standards, ensuring safety and environmental sustainability. Ideal for use in precision electronic assemblies, it enhances thermal transfer efficiency and durability in demanding applications.

View 40111020Datasheet [pdf]

Buy the Wurth Series WE-TGF Thermal Gap Filler Pad: 40111020

Purchase the Wurth WE-TGF Thermal Gap Filler Pad 40111020 online today and ensure excellent heat dissipation for your electronic components. With its silicone and ceramic composition, it provides high thermal conductivity and electrical insulation, making it ideal for demanding electronic applications. Its wide operating temperature range from -50°C to +180°C guarantees stable performance in various environments. Certified RoHS, REACH, and halogen-free, this product enhances device safety and environmental compliance. Secure your supply of this reliable thermal management solution easily via our online store and keep your electronic systems running efficiently and safely.

Buy Wurth WE-TGF Thermal Gap Filler Pad 40111020 now and experience unmatched reliability and thermal management performance in electronic assemblies.