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WURTH ELEKTRONIK 885012107018 Ceramic Capacitor

The WURTH ELEKTRONIK WCAP-CSGP series ceramic capacitors are designed for general electronic equipment applications. These MLCCs offer a capacitance of 4700000 pF, a rated voltage of 25V, and a dissipation factor of ≤ 10%. They exhibit high isolation resistance (≥ 0.02 GΩ) and are suitable for applications requiring stable and reliable capacitance. The capacitors are compliant with RoHS standards and operate effectively within a temperature range of -55°C to +85°C. Refer to the provided soldering specifications for optimal reflow profile adherence.

Authorized Distributors
Source:Newark
Part No:885012107018
Stock:1810
Inv Date:06-12-2026
Price: Unit price: $0.344
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Source:DigiKey
Part No:885012107018
Stock:14133
Inv Date:06-12-2026
Price: Unit price: $0.23
Buy/RFQ:
Part No:885012107018
Stock:31363
Inv Date:06-12-2026
Price: Unit price: $0.33
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WURTH ELEKTRONIK 885012107018 Ceramic Capacitor Specifications:

  • A Dimensions L ± 0.2 [mm]: 2.0
  • A Dimensions W ± 0.2 [mm]: 1.25
  • A Dimensions H ± 0.2 [mm]: 1.25
  • A Dimensions E ± 0.2 [mm]: 0.5
  • A Dimensions l - Reflow [mm]: 2.80
  • A Dimensions p - Reflow [mm]: 1.00
  • A Dimensions w - Reflow [mm]: 1.30
  • A Dimensions l - Wave [mm]: 3.20
  • A Dimensions p - Wave [mm]: 1.40
  • A Dimensions w - Wave [mm]: 1.30
  • Capacitance: 4700000 pF
  • Rated Voltage: 25 V (DC)
  • Dissipation Factor: ≤ 10%
  • Isolation Resistance: ≥ 0.02 GΩ
  • Test Conditions: 1±0.2 Vrms, 1 kHz ±10%
  • Temperature Coefficient: ± 15% max.
  • Storage Conditions: 35°C, <45% RH
  • Operating Temperature: -55 °C up to +85 °C
  • Dielectric Strength: 5 sec. @250% UR; Charge & Discharge Current < 50mA
  • General Test Conditions: 25°C, 30-70% RH
  • Adhesive Strength of Termination (0402 & 0603): 10 ±1 sec; 5N
  • Adhesive Strength of Termination (>0603): 10 ±1 sec; 10N
  • Vibration Resistance: all 3 directions, 2 hours each @ 10 - 55 - 10 Hz, amplitude 0.75 mm or 10 g
  • Resistance to Solder Heat Solder Temperature: 260°C ±5°C
  • Resistance to Solder Heat Dipping Time: 10 ±1 sec
  • Peak package body temperature (PB-Free Assembly < 1.6 mm): 260°C
  • Peak package body temperature (PB-Free Assembly 1.6 - 2.5 mm): 260°C
  • Peak package body temperature (PB-Free Assembly ≥ 2.5 mm): 245°C

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WURTH ELEKTRONIK

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