The BGA heatsinks incorporate high thermal conductivity, cushioning, and gap-filling properties, making them ideal for attaching to MPU, chipsets, and plastic-encapsulated components. Supplied with thermal tape, these heatsinks feature a 0.10 mm aluminum foil backing coated with high-temperature acrylic adhesive, ensuring reliable thermal interface performance. With a total thickness of 0.27 mm, they offer excellent heat dissipation, adhesive strength, and versatility for fixing components to vertical heatsinks or metal enclosures. Suitable for various electronic applications, these heatsinks optimize heat management effectively.
Upgrade your electronic components with our high-quality BGA heatsinks featuring thermal tape, aluminum backing, and excellent heat dissipation. Designed for reliable heat sink attachment, these heatsinks ensure optimal thermal management for MPU, chipsets, and plastic-encapsulated components. Easy to install with strong acrylic adhesive, they provide outstanding thermal performance, durable adhesion, and versatility for various applications. Perfect for improving device longevity and thermal efficiency, order online today for fast, dependable delivery and support.
You can click on the BUY or RFQ button to purchase BGAPP015 from an authorized ABL-Aluminium-Components distributor.
You can download the BGAPP015 datasheet or visit the ABL-Aluminium-Components website for support.
ABL-Aluminium-Components