BGA heatsinks with thermal pads designed for efficient heat dissipation in electronic components. All heatsinks are supplied with thermal tape featuring high thermal conductivity, excellent cushioning, and gap-filling properties, making them ideal for attaching to MPU, chip sets, and plastic-encapsulated components. The aluminium foil-backed thermal interface tape has a total thickness of 0.27mm, with a high-temperature acrylic adhesive on both sides, ensuring strong adhesion and thermal performance. Suitable for vertical heatsink attachment and metal enclosure surfaces, providing reliable thermal management in electronic assemblies.
Purchase ABL Series BGA-PP heatsinks online today to ensure optimal thermal management for your electronic devices. These heatsinks come with high-quality thermal pads featuring excellent thermal conductivity, strong adhesive properties, and reliable gap filling. Designed for easy attachment to MPU, chipsets, and plastic-encapsulated components, they provide efficient heat dissipation. The aluminium foil-backed adhesive tape is suitable for vertical heatsink and enclosure surface applications, offering durability and high performance in electronic assembly and cooling solutions.
You can click on the BUY or RFQ button to purchase BGAPP025 from an authorized ABL-Aluminium-Components distributor.
You can download the BGAPP025 datasheet or visit the ABL-Aluminium-Components website for support.
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