This high-performance BGA heatsink features a compact 21x21 mm size with a 9 mm height, designed for efficient heat dissipation of integrated circuit components. Supplied with thermal tape, it provides excellent thermal conductivity and easy attachment to various MPU, chipsets, and plastic components. Its aluminum foil backing and acrylic adhesive ensure high heat resistance and strong adhesion, making it ideal for maintaining optimal operating temperatures in electronics. Suitable for applications requiring effective thermal management in compact spaces, it enhances device reliability and longevity.
Order the BGA heatsink online today to ensure optimal thermal management for your electronic devices. This compact heatsink with thermal tape offers reliable heat dissipation, easy installation, and high durability. Designed specifically for application on MPU, chipsets, and plastic components, it helps improve device reliability and extend operational life. With excellent thermal conductivity and adhesive properties, this heatsink ensures your electronics stay cool under demanding conditions. Make your purchase now for rapid delivery and superior performance assurance.
You can click on the BUY or RFQ button to purchase BGASTD020 from an authorized ABL Aluminium Components distributor.
You can download the BGASTD020 datasheet or visit the ABL Aluminium Components website for support.
ABL Aluminium Components