The BergStak® 0.8mm Mezzanine Connector by Amphenol is designed for high-density, high-speed, parallel board-to-board connections supporting up to 12Gb/s. It features a flexible range with 16 PCB stack heights from 5mm to 20mm, accommodating 40 to 200 positions in 20-position increments. Made from UL94V-0 materials, it offers durable gold or palladium-nickel finishes, low mating force, and environmental compliance including RoHS. Its precision design ensures reliable mating, anti-reverse features, and suitability for high-performance applications like servers, networking, and industrial equipment.
Contact Base Metal: Copper Alloy (Receptacle), Brass (Plug)
Contact Area Finish: Gold or Palladium-Nickel over Nickel
Solder Area Finish: Matte pure Tin over Nickel
Durability: 100 mating cycles
Mating Force: 0.9N max./contact
Unmating Force: 0.1N min./contact
Insulation Resistance: Initial 10MΩ min., after test 100MΩ min.
Current Rating: 0.8A per contact
Voltage Rating: 100VAC
Impedance Range: 81 to 108Ω @ 50 ps edge
Return Loss: < 10dB up to 5GHz
Environmental: -40°C to +125°C, high temp life 105°C for 1000 hours, humidity 90-95%
Certifications: UL Listed, GS-12-547
Packaging: Tape & Reel, Tubes
Buy the Buy Amphenol BergStak 0.8mm Mezzanine Connector Part Number 61083041402LF Online
Purchase the BergStak 0.8mm Mezzanine Connector from Amphenol online today and enjoy a reliable, high-density, high-speed interconnect solution suitable for demanding applications. With support for 12Gb/s data transmission, 40 to 200 positions, and multiple stack heights, this connector ensures flexibility and durability in your electronic and industrial projects. Made from UL94V-0 materials and RoHS compliant, it guarantees safety, environmental compliance, and long-term performance. Ideal for servers, industrial equipment, routers, and high-performance computing systems, it offers excellent mating reliability and low insertion forces for easy assembly.
Buy Amphenol BergStak 0.8mm Mezzanine Connector now and experience unmatched high-speed performance with reliable high-density board-to-board connections.
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