BergStik 2.54mm unshrouded headers are versatile connectors suitable for Board-to-Board, Wire-to-Board, and Cable-to-Board applications in electronic devices. Designed with high-temperature thermoplastic housing and phosphor-bronze pins, they feature gold or tin plating over nickel for enhanced performance and corrosion resistance. These headers support reflow soldering processes, withstand operating temperatures from -65°C to +125°C, and provide reliable connection with a current rating of 3A per contact. They are available in multiple configurations including straight, right angle, stacking, and pin-in-paste, accommodating various project needs efficiently.
Housing Material: High temperature thermoplastic, Black
Flammability Rating: UL94V-0
Pin Material: Phosphor-bronze
Plating: Gold or Tin over 1.27μm Nickel
Electrical Current Rating: 3A per contact
Insulation Resistance: 5000MQ min
Dielectric Withstanding Voltage: 1500V
Operating Temperature: -65°C to +125°C
Mechanical Retention Force: 9N min.
Tolerance for mating and soldering: max. 27mm length for mating
Compatible with wave, vapor-phase, and IR reflow soldering
Available in single and double row configurations from 2 to 72 positions
RoHS compliant
Packaging options include bags, tape-and-reel, and tubes with pick-up caps
Buy the Buy BergStik 2.54MM Unshrouded Headers Part Number 68691210HLF Online
Enhance your electronic assemblies with BergStik 2.54mm Unshrouded Headers. Designed for versatility, these connectors support various mounting configurations including straight, right angle, stacking, and pin-in-paste methods. Manufactured with high temperature thermoplastic housing and phosphor-bronze contacts plated in gold or tin, they provide a high current rating of 3A per contact and operate from -65°C to +125°C. Choose reliable, RoHS-compliant headers available in multiple configurations to meet your specific application needs seamlessly.
Order your BergStik 2.54MM Unshrouded Headers 68691210HLF today and ensure reliable connections for your electronic projects with flexible vertical and stacking options.
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