The Double Density Cool Edge 0.80mm connectors from Amphenol ICC are high-speed, space-saving hybrid board-to-board connectors supporting PCIe Gen 5 and up to 32GT/s speeds. Featuring a compact design with 2 rows of contacts, they accommodate various board thicknesses like 1.60mm and 2.36mm, offering flexible configurations for differential, single-ended, and power pins. Made from copper alloy with gold over nickel contacts, they are RoHS compliant, support up to 70 lanes, and deliver 2A per power pin. Suitable for high-density applications in networking, computing, and server systems, they ensure reliable performance with 100 mating cycles.
Contact Material: Copper alloy with gold over nickel finish
Contact Resistance: Max 30mΩ initially, change max 15mΩ after test
Current Rating: 2A per power pin, 0.5A per signal pin
Dielectric Withstanding Voltage: 500V
Operating Voltage: 12V DC
Durability: 100 mating cycles
Mating Force: Max 0.38N per pin for signal
Unmating Force: Min 0.03N per pin for signal
Temperature Range: -55°C to +105°C
Thermal Shock: 10 cycles between -55°C and +85°C
Humidity Resistance: 24 cycles, 25°C to 83°C at 80-85% RH
Certifications: RoHS compliant
Housing: High temperature thermoplastic (UL 94V-0)
Packaging: Tray, Tape & Reel (supporting less than 284 pins)
Buy the Buy Amphenol ICC Double Density Cool Edge 0.80mm Connectors Part Number CED012481142001 Online
Order the Amphenol ICC Double Density Cool Edge 0.80mm connectors online to enjoy high-speed performance, flexible configurations, and space-saving design suitable for PCIe Gen 5 and high-density environments. These connectors support up to 70 lanes, deliver 2A per power pin, and are RoHS compliant. Perfect for networking, server, and high-end computing applications, they provide excellent reliability, durability for 100 mating cycles, and are available in various packaging options. Upgrade your system with trusted connectivity solutions today for maximum efficiency and performance.
Get Amphenol ICC CED012481142001 today—designed for high-speed, space-efficient system interconnects and reliable performance in demanding applications.
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