The C-Grid III Interconnects are 2.54mm pitch, dual-row modular crimp housings designed for wire-to-board signal applications. These black plastic housings support 12 circuits and feature a stackable design without buttons or polarization for flexible assembly. Certified with UL E29179 and RoHS compliant, they operate within -55°C to +105°C. Suitable for various electrical systems, these housings provide reliable connections for signal transmission, and are compatible with C-Grid III header and crimp terminal series, ensuring high durability and easy installation in electronic and industrial applications.
Discover and purchase the Molex C-Grid III Interconnect housing with 12 circuits, 2.54mm pitch, stackable dual-row design, and RoHS compliance. Built from durable plastic, it operates between -55°C and +105°C, offering reliable signal connections for electronics and industrial applications. Compatible with C-Grid header and crimp terminal series, this housing ensures secure, efficient wiring in a compact form. Perfect for systems demanding robust signal transmission, easy assembly, and high durability. Order now for quick delivery and professional quality.
You can click on the BUY or RFQ button to purchase 901430012 from an authorized MOLEX distributor.
You can download the 901430012 datasheet or visit the MOLEX website for support.
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