MULTICOMP-PRO MPGCS020FGP30CC Thermal Gap Putty

Thermal Flowable Gap Putty is a white, high thermal conductivity material designed for filling irregular gaps between heat sources and sinks. It remains in place without flowing after setting, ensuring consistent contact and enhanced heat transfer. Suitable for use in communications equipment, automotive electronics, and networking modules, this non-flowing gap filler withstands temperatures from -40°C to +200°C. It provides excellent thermal impedance of 0.06°C-in2/W and thermal conductivity of 2W/mK, with a dispensing rate of 30g/min, making it ideal for delicate electronic applications requiring efficient heat dissipation.

View MPGCS020FGP30CCDatasheet [pdf]

Buy the Multicomp Pro MPGCS020FGP-30cc – Reliable Thermal Gap Putty for Industrial Applications

Experience superior thermal management with Multicomp Pro Thermal Gap Putty, designed to fill gaps and improve heat transfer in sensitive electronics. Its non-flowing formula maintains perfect contact between heat sources and sinks, ensuring efficient cooling for automotive electronics, communication equipment, and networking modules. With a temperature range from -40°C to +200°C, high thermal conductivity of 2W/mK, and easy dispensing at 30g/min, this high-quality putty guarantees durability, performance, and enhanced device reliability. Purchase online today for dependable thermal solutions.

Get Multicomp Pro thermal gap putty today—built for precision and long-lasting heat dissipation in electronic devices.