MULTICOMP-PRO MPGCS070FGP30CC Thermal Gap Putty

This thermal flowable gap putty is designed to improve heat transfer between irregular surfaces such as heat sources and sinks by filling air gaps and voids. Its graphene-reinforced composition offers high thermal conductivity of 7W/mK and maintains superior contact without flowing when set. Suitable for communications equipment, automotive electronics, and cooling modules, it features V-0 rated flame resistance, operating temperature from -50°C to +200°C, dielectric strength exceeding 5Kv/mm, and a volume resistivity of 10^7 ohm-m. Easy to apply, it ensures efficient thermal management in electronics and industrial applications.

View MPGCS070FGP30CCDatasheet [pdf]

Buy the Buy Multicomp Thermal Flowable Gap Putty Part Number MPGCS-070-FGP-30cc Online

Purchase the Multicomp Thermal Flowable Gap Putty MPGCS-070-FGP-30cc online to ensure your electronic components stay cool and operate efficiently. With high thermal conductivity of 7W/mK, it effectively fills gaps and improves heat transfer between heat sources and sinks. Its graphene reinforcement provides superior performance, with stable operation from -50°C to +200°C, V-0 flame rating, and excellent dielectric properties. Compact 30ml packaging makes it easy for electronics repair, automotive, and communication equipment cooling applications. Order now for long-lasting thermal management.

Get Multicomp Thermal Flowable Gap Putty MPGCS-070-FGP-30cc today—designed for high thermal performance and reliable heat management in electronics.