MULTICOMP-PRO MPGCS020NSB15020A Thermal Interface Pad

This high-performance, non-silicone thermal interface pad offers excellent thermal conductivity of 2W/mK, good electrical insulation, and low contact resistance. Its good compressibility and long-term stability make it suitable for effective heat dissipation in electronic assemblies. The pad is flexible with a thickness range from 0.5mm to 3mm, and features a blue color with a single-sided 3M-467 adhesive for easy application. It operates over -40°C to +150°C, is UL94 V-0 rated, and ideal for maintaining optimal thermal management in various electronic devices.

View MPGCS020NSB15020ADatasheet [pdf]

Buy the Buy Multicomp Pro Non-silicone Thermal Interface Pad Part Number MPGCS020NSB150-0.5A Online

Order the Multicomp Pro thermal interface pad today for reliable heat dissipation in electronics. This non-silicone pad features 2W/mK thermal conductivity, flexible thickness options, excellent stability, and easy application with adhesive backing. Designed for high-performance thermal management, it operates over -40°C to +150°C and is UL94 V-0 rated for safety. Suitable for various electronic devices requiring effective heat transfer, this high-quality thermal interface material ensures longevity, stability, and efficient heat transfer, reducing device overheating and improving system reliability.

Get Multicomp Pro MPGCS020NSB150-0.5A today—designed for efficient thermal management and long-lasting electronic cooling.