MULTICOMP-PRO MPGCSDGP202P Thermal Gap Filler

This two-part dispensing thermal gap filler offers reliable thermal management for electronic devices and industrial applications. Designed with long-term thermal stability, it resists pumping out from bond lines, making it ideal for rapid temperature cycling. Suitable for automotive ECUs, power supplies, microprocessors, and display electronics, the product features quick curing when heated, excellent dielectric properties, and a V-0 flammability rating. The yellow and white components ensure visible application, with a high thermal conductivity of 2W/mK and volume resistivity of 10¹² ohm-m. Operating from -60°C to +200°C, it provides durable bonding and efficient heat dissipation.

View MPGCSDGP202PDatasheet [pdf]

Buy the multicomp MPGCS-DGP20-2P – Reliable Thermal Gap Filler for Industrial Applications

Enhance your thermal management with our two-part dispensing thermal gap filler, offering reliable heat dissipation for automotive ECUs, power supplies, microprocessors, and electronics. This yellow and white compound features a thermal conductivity of 2W/mK, excellent dielectric properties, and operates efficiently from -60°C to +200°C. Its fast curing when heated reduces downtime, while the long-term stability ensures durable performance. Easy to apply with industrial dispensing equipment or stencil printing, it’s ideal for rapid temperature cycling and demanding electronic applications. Ensure optimal heat transfer and reliability in your electronic assemblies today.

Buy multicomp MPGCS-DGP20-2P now and experience unmatched reliability and performance in thermal management solutions.