The Ultra Soft Thermal Pads are yellow, highly flexible thermal management solutions with a thermal conductivity of 3.5 W/mK. Designed for high power electronics, these pads offer excellent thermal transfer, high compressibility, and good conformability for applications such as ICs, CPUs, motherboards, power supplies, and LED modules. They feature a Shore 00 hardness of 30, a voltage breakdown of 6 kV/mm, and operate within -50 to +150°C. Available in various thicknesses, these pads are flame-rated V-0 and RoHS compliant, ensuring safe and efficient heat dissipation for electronic components.
Experience high-performance thermal management with Multicomp Series Ultra Soft Thermal Pads. Designed for electronic components like CPUs, ICs, and power supplies, these pads offer 3.5W/mK thermal conductivity, high flexibility, and excellent conformability. Available in multiple thickness options, they ensure optimal heat dissipation and safety with flame rating V-0 and RoHS compliance. Perfect for high power devices in demanding applications such as LED modules, motherboards, and telecom equipment. Secure your electronics' longevity by purchasing online today.
You can click on the BUY or RFQ button to purchase MPTGA350015010 from an authorized MULTICOMP-PRO distributor.
You can download the MPTGA350015010 datasheet or visit the MULTICOMP-PRO website for support.
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