The MTMM series is a modified through-hole header designed for reliable board-to-board connections in industrial and electronic applications. Constructed with black liquid crystal polymer insulation and phosphor bronze terminals, these headers offer excellent thermal stability from -55°C to +125°C and RoHS compliance. With optional gold or tin plating, they ensure solderability and corrosion resistance. These headers come in various configurations, with multiple position options, and are suitable for high-reliability, custom electronics where space and durability are critical. The series supports various mounting styles, ensuring compatibility with different PCBs and equipment requirements.
Operating Temp Range: -55 °C to +105 °C with Tin; -55 °C to +125 °C with Gold
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch: 2.00 mm (.0787 inch)
Number of Positions: Variable, with extensive options
Height Options: Ranges from 6.48 mm (0.255 inch) to 21.08 mm (0.830 inch)
Mounting Style: Through-hole, modified headers
Design Flexibility: Custom configurations available, non-standard series
Temperature Range: -55°C to +125°C for gold-plated contacts
Certifications: RoHS compliant
Buy the Samtec MTMM14307GD300 – Reliable Modified Through-Hole Headers for Industrial Applications
Order the Samtec MTMM14307GD300 through-hole header online today and enhance your electronic assemblies with high-quality, customizable, solderable, RoHS-compliant connectors. Designed for durability and versatility, these headers support various configurations and heights, making them ideal for industrial equipment and PCB applications. With fast shipping and expert support, purchasing online provides a seamless experience to ensure your projects meet high standards for quality and reliability.
Buy Samtec MTMM14307GD300 now and experience unmatched reliability and performance in your electronic and industrial projects.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase MTMM14307GD300 from an authorized SAMTEC distributor.
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