TE Connectivity's DDR3 DIMM sockets provide robust interconnect solutions for a variety of applications including servers, notebooks, and communications equipment. These sockets adhere to JEDEC industry standards and are engineered to deliver peak performance in high-speed data environments. Available in various configurations including right-angle surface mount and vertical thru-hole designs, they offer flexibility in system integration. Plating options include gold flash and gold, catering to different performance and cost requirements. The 2013311-1 variant specifically offers a right-angle surface mount design with gold flash plating and a black housing, packaged in a tray.
You can click on the BUY or RFQ button to purchase 20133111 from an authorized TE CONNECTIVITY distributor.
You can download the 20133111 datasheet or visit the TE CONNECTIVITY website for support.
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