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TE CONNECTIVITY 23399787 zSFP+ Data Interconnect

The zSFP+ interconnect is designed for high-speed data transfer, supporting up to 28 Gbps NRZ and 56 Gbps PAM-4. It offers backward compatibility with SFP+ products, allowing hot-swapping and system upgrades without complete redesign. Its surface-mount design supports various port configurations in single and stacked assemblies, enhancing system density and flexibility. The connector includes EMI containment options, corrosion-resistant plating, and operates within -40°C to +85°C. Suitable for telecommunications, data centers, medical, and networking equipment, it ensures reliable, high-performance data interconnection with excellent signal integrity.

Authorized Distributors
Source:Newark
Part No:2339978-7
Stock:2
Inv Date:06-09-2026
Price: Unit price: $102.8
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Source:DigiKey
Part No:2339978-7
Stock:7
Inv Date:06-09-2026
Price: Unit price: $88.94
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Source:DigiKey
Part No:2339978-7
Stock:63
Inv Date:06-09-2026
Price: Unit price: $70.83
Buy/RFQ:
Part No:2339978-7
Stock:26
Inv Date:06-10-2026
Price: Unit price: $88.94
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Part No:2339978-7
Stock:0
Inv Date:06-09-2026
Price: Unit price: $134.93
Buy/RFQ:
Part No:2339978-7
Stock:63
Inv Date:06-09-2026
Price: Unit price: $133.61
Buy/RFQ:
Part No:2339978-7
Stock:63
Inv Date:06-09-2026
Price: Unit price: $133.61
Buy/RFQ:
Part No:2339978-7
Stock:42
Inv Date:06-09-2026
Price: Unit price: $72.19
Buy/RFQ:

TE CONNECTIVITY 23399787 zSFP+ Data Interconnect Specifications:

  • Data Rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, supporting 10 GbE and 16 Gb FC
  • Voltage (max.): 120V AC
  • Current (max.): 0.5A
  • Dielectric Withstanding Voltage: 300V AC between contacts
  • Operating Temperature: -40°C to +85°C
  • Housing Material: High-temperature thermoplastic, UL 94V-0
  • Contact Material: Copper alloy, nickel underplating with tin or gold plating
  • Mating Force: 25N, Unmating Force: 11.5N
  • Durability: Minimum 250 cycles
  • Physical Dimensions: Suitable for single and stacked cage configurations, minimal PCB footprint
  • Connector Compatibility: Shares mating interface with SFP+
  • Insulation and EMI options: Elastomeric gasket or spring finger options, EMI containment features
  • Assembly Configurations: 1x1 to 1x6 port options, stacked assemblies in various configurations
  • Additional features: Heat sinks, LEDs, light pipes available, RoHS compliant

Buy the TE Connectivity Series zSFP+ Data Interconnect: 23399787

Purchase the TE Connectivity zSFP+ 23399787 online to experience reliable high-speed data connectivity with support for up to 28 Gbps NRZ and 56 Gbps PAM-4. Ideal for telecommunications, data centers, and networking, this versatile interconnect features backward compatibility with SFP+ modules, ease of installation, and flexible configurations including single and stacked port options. Designed to operate from -40°C to +85°C, it ensures robust performance, excellent signal integrity, and long-term durability—perfect for mission-critical applications requiring minimal insertion loss and EMI suppression. Buy now to upgrade your system effortlessly and efficiently.

Get TE Connectivity zSFP+ 23399787 today—built for high-speed data transfer and long-lasting durability.

Frequently Asked Questions

Where can I buy TE CONNECTIVITY 23399787?

You can click on the BUY or RFQ button to purchase 23399787 from an authorized TE CONNECTIVITY distributor.

How do I troubleshoot issues or seek technical support for part 23399787?

You can download the 23399787 datasheet or visit the TE CONNECTIVITY website for support.

Who is the manufacturer of 23399787?

TE CONNECTIVITY

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