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AMPHENOL COMMUNICATIONS SOLUTIONS 10147613121406LF Board-to-Board Connector
The AMPHENOL BergStak HS 0.80mm Board-to-Board Connector family is designed for high-speed data applications requiring reliable performance. It supports PCIe Gen 5 up to 32Gb/s, features a 0.80mm pitch, and offers options for stack height and grounding. Constructed with glass-filled LCP and copper alloy, these connectors are ideal for server storage, industrial automation, and medical equipment. They meet SAS 4.0 and PCIe Gen 5 standards and are RoHS compliant, ensuring environmental responsibility.
AMPHENOL COMMUNICATIONS SOLUTIONS 10147613121406LF Board-to-Board Connector Specifications:
- Material_Housing: Glass filled LCP (UL94V-0, MSL level 1)
- Contact_Base_Metal: Copper alloy
- Receptacles: Copper alloy, high spring
- Headers: Copper alloy
- Amphenol_Product_Specification: GS-12-1499
- Packaging: Tape & Reel
- Plating_Solder_Area: Matte pure tin over nickel
- Plating_Contact_Area: Gold
- Current_Rating: 0.8A per contact
- Contact_Resistance: 50m Ω max.
- Signal_Integrity_SAS_4.0: N/A
- Data_Rate_SAS_4.0: up to 24Gb/s
- Multiline_Crosstalk_SAS_4.0: < 0.5% at 20ps (20-80%)
- Differential_Impedance_SAS_4.0: 100 Ω
- Single_Ended_Impedance_SAS_4.0: 50 Ω
- Signal_Integrity_PCIe_Gen_5: N/A
- Data_Rate_PCIe_Gen_5: Up to 32Gb/s
- Multiline_Crosstalk_PCIe_Gen_5: < 0.5% at 15ps (20-80%)
- Differential_Impedance_PCIe_Gen_5: 85 Ω
- Single_Ended_Impedance_PCIe_Gen_5: 42.5 Ω
- Durability: 100 cycles
- Mating_Force: 0.9N max. /contact
- Un_mating_Force: 0.1N min. /contact
- Gauge_Retention_Force: >0.1N
- Mixed_Flow_Gas: Duration 7 days
- Vibration_Sinusoidal: 11.95g
- Temperature_Life: 125°C for 96 hours
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How do I troubleshoot issues or seek technical support for part 10147613121406LF?
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AMPHENOL COMMUNICATIONS SOLUTIONS