The double density Cool Edge 0.80mm connectors by Amphenol ICC are high-speed, space-saving hybrid connectors designed for compact board-to-board applications. With configurations supporting PCIe Gen 5 and differential, single-ended, and power pins, these connectors feature a 0.80mm pitch, accommodate 76 to 428 contacts, and support high data rates up to 32GT/s. Constructed with gold-plated copper alloy contacts and high-temperature thermoplastic housings, they offer reliable performance, durability for 100 mating cycles, and are suitable for high-density and next-generation system interconnects in networking, high-end computing, and storage systems.
Housing: High temperature thermoplastic (UL 94V-0)
Current Rating: 2A per pin for power, 0.5A per pin for signal
Initial Contact Resistance: 30mΩ max.
Voltage Rating: 12V DC (up to 500V withstand voltage)
Durability: 100 mating cycles
Mating Force: 0.38N/pin max.
Unmating Force: 0.03N/pin min.
Operating Temperature Range: -55°C to +105°C
Temperature Life: 10542°C for 240 hours
Thermal Shock: 10 cycles between -55°C and +85°C
Humidity Resistance: 24 cycles at various temperature and humidity conditions
Certifications: RoHS compliant
Buy the Amphenol ICC – Reliable Double Density Cool Edge 0.80mm Connectors for Industrial Applications
Enhance your electronic systems with Amphenol ICC's high-speed hybrid connectors featuring 0.80mm pitch. These space-saving connectors support PCIe Gen 5, up to 428 contacts, and are ideal for high-density applications in networking, storage, and high-end computing. Constructed with durable gold-plated copper contacts and high-temperature thermoplastic housings, they ensure reliable performance, extended mating cycles, and excellent environmental resistance. Buy online now for a compact, high-performance interconnect solution that meets next-generation data speed requirements and maximizes system flexibility and footprint efficiency.
Order your Amphenol Series CED014281112001 high-speed connectors today and enhance your system’s reliability and performance with space-efficient, high-speed board-to-board solutions.
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