The Thin Film Chip Inductor from the AL Series is a high-performance, RoHS-compliant component designed for RF applications in mobile communication devices, wireless LAN, Bluetooth modules, and GPS systems. It features a photolithographic single-layer ceramic structure with high self-resonant frequency, excellent Q factor, and superior temperature stability. Its tight tolerance of ±1% or ±0.1nH ensures precise inductance values, making it ideal for critical high-frequency circuit designs. The inductor provides stable inductance at high frequencies, with construction on alumina substrate, inner Ni-electrode, Cu circuits, and Sn overcoat for durability and reliable soldering.
MULTICOMP PRO MCFT0BT0N5 Thin Film Chip Inductor Specifications:
Construction: Alumina substrate, inner Ni-electrode, Cu circuits, Sn overcoat
RoHS compliant
Inductance Range: 0.1nH to 20.8nH
Tolerance: ±1% or ±0.1nH
Self resonant frequency: controlled within 10%
Peak reflow temperature: 265°C with 2-3 reflow cycles allowed
Temperature stability: high stability for critical RF applications
Dimensions: 0201 (0.6 x 0.3 mm), 0402 (1.0 x 0.5 mm)
Rated current: up to 500 mA depending on model
High Q factor and SRF (GHz): 10/500 MHz to 13/500 MHz depending on inductance
Durable construction with Sn overcoat for solderability
Environmental resistance: Insulation resistance > 1,000 MΩ, withstand damp heat, temperature cycling, and vibration tests
Designed for use in VCO, TCXO, RF transceivers, cellular phones, GPS devices, wireless LAN, and Bluetooth technology
Buy the Buy IB (industry broad keyword) Thin Film Chip Inductor Part Number MCFT0BT0N5 Online
Order the high-stability Thin Film Chip Inductor from AL Series today to ensure optimal performance in your RF and wireless communication circuits. This RoHS-compliant ceramic component features precise inductance values with tight tolerances, high self-resonant frequency, and excellent temperature stability, making it perfect for critical applications like cellular, GPS, Bluetooth, and Wi-Fi modules. Its durable construction and reliable solderability facilitate easy integration into complex electronic assemblies, ensuring long-lasting, high-performance operation for demanding high-frequency designs.
Get IB MCFT0BT0N5 today—built for high-frequency stability and reliable performance in RF communication modules.
Frequently Asked Questions
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You can download the MCFT0BT0N5 datasheet or visit the MULTICOMP PRO website for support.
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MULTICOMP PRO
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