The Ultra Soft Thermal Pads multicomp pro are designed for high-performance thermal management in electronic devices. With a thermal conductivity of 12.5 W/mK, these green pads offer excellent heat transfer, high compressibility, and electrical insulation properties. Suitable for applications like ICs, CPUs, motherboards, and power supplies, they feature low thermal resistance and are compliant with RoHS standards. Available in various thicknesses from 0.5mm to 2mm, these durable sheets provide reliable performance for high-power electronics, ensuring efficient heat dissipation in demanding environments.
Enhance your electronic cooling solutions with our high-performance thermal pads. Featuring 12.5 W/mK thermal conductivity, these pads are perfect for ICs, CPUs, and power modules. Their flexible, high compressibility makes assembly easier, while providing low thermal resistance for optimal heat transfer. Manufactured with RoHS compliance, the green thermal pads are available in various thicknesses from 0.5mm to 2mm, offering reliable performance across diverse applications such as heat sinks, LED lighting, and telecom devices. Order online now for quick delivery and seamless integration into your projects.
You can click on the BUY or RFQ button to purchase MPTGA125015010 from an authorized MULTICOMP PRO distributor.
You can download the MPTGA125015010 datasheet or visit the MULTICOMP PRO website for support.
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