The Ultra Soft Thermal Pads from multicomp®ro are high-quality gray thermal interface materials designed for efficient heat transfer in electronic applications. With a thermal conductivity of 2.2 W/mK and thickness options ranging from 0.5 mm to 2 mm, these pads offer excellent compressibility and insulation. Suitable for high power electronics such as CPUs, ICs, LED modules, and power supplies, the pads feature a non-sticky surface on one side for easy assembly. They are RoHS compliant, flame rated V-1 UL94, and operate efficiently across temperatures from -40°C to +180°C, ensuring reliable thermal management in demanding electronic systems.
Secure your high-performance electronic systems with multicomp®ro Ultra Soft Thermal Pads. These gray, 2.2 W/mK thermal interface materials are available in various thicknesses up to 2mm, providing excellent heat transfer and insulation for CPUs, ICs, power supplies, and LED modules. Easy to assemble with a non-sticky surface, they withstand temperatures from -40°C to 180°C. Designed for durability and efficiency, order online now to enhance your electronic device’s thermal performance quickly and reliably.
You can click on the BUY or RFQ button to purchase MPTGA220015005 from an authorized MULTICOMP-PRO distributor.
You can download the MPTGA220015005 datasheet or visit the MULTICOMP-PRO website for support.
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