High-performance ultra soft thermal pads designed for effective heat dissipation in electronic components, including CPUs, ICs, power supplies, and LED modules. These purple thermal pads feature a thermal conductivity of 4.5 W/mK and are available in various thicknesses from 0.5mm to 3mm. Made with high compressibility and natural tack, they ensure reliable contact between components and heat sinks. Suitable for applications requiring high thermal management, RoHS compliant, flame rated V-0, and with dielectric breakdown voltage of 6 kV/mm, these pads optimize heat transfer while maintaining electrical insulation.
Enhance your electronic device cooling with multicomp® Ultra Soft Thermal Pads, available in various thicknesses. These high thermal conductivity pads ensure efficient heat transfer from heat-sensitive components like CPUs, ICs, and power supplies. Designed with high compressibility and natural tack, they provide excellent contact and reliable performance in demanding environments, including industrial and consumer electronics. RoHS compliant and flame rated V-0, these thermal pads optimize heat dissipation, improve device longevity, and ensure safety. Purchase online easily for fast delivery and professional results.
You can click on the BUY or RFQ button to purchase MPTGA450015020 from an authorized MULTICOMP-PRO distributor.
You can download the MPTGA450015020 datasheet or visit the MULTICOMP-PRO website for support.
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