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TE CONNECTIVITY 23492025 zSFP+ Interconnect

The zSFP+ pluggable I/O interconnect is among the fastest single-channel connectors, supporting data rates up to 28 Gbps NRZ and 56 Gbps PAM-4. Designed for backward compatibility with SFP+ products, it enables system upgrades for 28-56 Gbps speeds effortlessly. Suitable for telecommunications, data centers, medical equipment, and networking, it supports various configurations including single high cages and stacked assemblies. Features include superior signal integrity, EMI containment options, and a thermoplastic housing, ensuring reliable high-speed data transfer in demanding applications. Its design balances performance, density, and ease of deployment with optional heat sinks, LEDs, and plating choices.

Authorized Distributors
Source:Newark
Part No:2349202-5
Stock:50
Inv Date:06-09-2026
Price: Unit price: $40.45
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Source:DigiKey
Part No:2349202-5
Stock:18
Inv Date:06-09-2026
Price: Unit price: $34.39
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Source:DigiKey
Part No:2349202-5
Stock:232
Inv Date:06-09-2026
Price: Unit price: $25.6
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Part No:2349202-5
Stock:0
Inv Date:06-10-2026
Price: Unit price: $28.03
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Part No:2349202-5
Stock:0
Inv Date:06-09-2026
Price: Unit price: $67.59
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Part No:2349202-5
Stock:232
Inv Date:06-09-2026
Price: Unit price: $63.3
Buy/RFQ:
Part No:2349202-5
Stock:232
Inv Date:06-09-2026
Price: Unit price: $63.3
Buy/RFQ:
Part No:2349202-5
Stock:153
Inv Date:06-09-2026
Price: Unit price: $28.03
Buy/RFQ:

TE CONNECTIVITY 23492025 zSFP+ Interconnect Specifications:

  • Data rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10 Gbps Ethernet, 16 Gbps Fibre Channel
  • Voltage (max.): 120V AC
  • Current (max.): 0.5A
  • Operating Temperature: -40 to +85°C
  • Material: High-temperature thermoplastic housing, copper alloy contacts
  • Plating: Nickel underplating; Tin plating on solder tail area; Gold plating on mating area with options of 15 or 30 μ” Gold or Palladium Nickel
  • Dimensions: Compatible with SFP+ cage dimensions, high-density configurations available
  • Mechanical durability: Minimum of 250 cycles
  • Mating force: 25N, Unmating force: 11.5N
  • Cage material: Nickel Silver
  • Assembly options: Single high cages, stacked assemblies, with optional heat sinks, LEDs

Buy the TE Connectivity Series zSFP+ Pluggable I/O Interconnect: 23492025

Enhance your high-speed communication infrastructure with the TE Connectivity zSFP+ Interconnect, supporting data rates up to 56 Gbps. Its backward compatibility with SFP+ modules allows seamless upgrades in telecom, data centers, and networking environments, ensuring reliable performance and density. Designed for easy installation, the connector features robust construction, EMI containment options, and versatile configurations such as high-density cages and stacked assemblies. Order online today to ensure your systems are equipped with the latest technology for efficient, high-performance data transfer in demanding applications.

Order your TE Connectivity Series zSFP+ 23492025 today and give your projects the dependable high-speed data transfer they deserve.

Frequently Asked Questions

Where can I buy TE CONNECTIVITY 23492025?

You can click on the BUY or RFQ button to purchase 23492025 from an authorized TE CONNECTIVITY distributor.

How do I troubleshoot issues or seek technical support for part 23492025?

You can download the 23492025 datasheet or visit the TE CONNECTIVITY website for support.

Who is the manufacturer of 23492025?

TE CONNECTIVITY

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