MULTICOMP-PRO MPGCSP30NS20005 Thermal Interface Pad

This high-performance non-silicone thermal interface pad is designed for efficient heat transfer in electronic applications. With a thermal conductivity of 3W/mK and excellent stability, it offers optimal thermal management under high temperatures and low pressures. The ultra-soft, glass fiber material provides electrical insulation, durability, and RoHS compliance. Available in various thicknesses from 0.5mm to 3mm, it features a light grey color, a dielectric constant of 12, and can operate between -40°C and +125°C. Ideal for ensuring reliable thermal contact in electronic assemblies.

View MPGCSP30NS20005Datasheet [pdf]

Buy the multicomp Reliable MPGCSP30NS2005 for Electronic Thermal Management

Enhance your electronic device cooling with our high-performance non-silicone thermal interface pad. Featuring 3W/mK thermal conductivity, light grey color, and various thickness options, it ensures optimal heat transfer at high temperatures. The ultra-soft, glass fiber material provides electrical insulation and stability under low pressure operation. RoHS compliant and capable of functioning from -40°C to +125°C, this pad is ideal for demanding electronic assemblies requiring reliable thermal contact, durability, and safety in various industrial and consumer electronics applications.

Buy multicomp MPGCSP30NS2005 non-silicone thermal interface pad now and experience unmatched reliability and performance for efficient heat dissipation.