The MOLEX / WALDOM 172501-8002 is a high-performance zSFP+ interconnect system designed for module-to-board applications. This receptacle features a stacked ganged assembly with metal spring fingers, providing enhanced airflow and 320 circuits for efficient data transmission. Constructed with a high-performance alloy (HPA) and gold plating for superior conductivity and durability, it's ideal for demanding industrial environments requiring reliable and high-speed connectivity. The connector supports a maximum current of 0.5A and a voltage of 30V AC/DC, ensuring stable power delivery. Its robust design and compliance with industry standards make it a versatile choice for various applications.